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Electrical & Electronic Components > Potting & Encapsulating Compounds

Potting & Encapsulating Compounds

Potting and encapsulating products protect electronic components from moisture, dirt, thermal shock, and vibration. Potting is a process where electronic components are immersed in resin, which is then cured. Encapsulating products are used to create a mold or frame around electronic components to fill gaps between the component and frame. Epoxies, silicone rubber, and polyurethane adhesives are commonly used in these processes.

$85.10 / PT
Volume price of $56.32 available
$671.17 / KT
Volume price of $602.08 available
$2,698.17 / KT
Volume price of $2,420.42 available
$25,517.62 / DR
Volume price of $22,890.81 available
$2,964.42 / PA
Volume price of $2,659.26 available
$337.83 / PA
Volume price of $303.05 available
$11,112.42 / DR
Volume price of $9,968.49 available
$1,216.23 / PA
Volume price of $1,091.03 available
$97.69 / P1
Volume price of $64.65 available
$976.83 / KT
Volume price of $876.27 available
$115.02 / P1
Volume price of $76.12 available
$976.83 / KT
Volume price of $876.27 available
$37,026.47 / DR
Volume price of $33,214.92 available
$976.83 / KT
Volume price of $876.27 available
$3,909.83 / KT
Volume price of $3,507.35 available
$4,301.62 / PA
Volume price of $3,858.81 available
$530.00 / PA
Volume price of $475.44 available
$4,070.40 / DR
Volume price of $3,651.39 available
$530.00 / PA
Volume price of $475.44 available
$4,070.40 / DR
Volume price of $3,651.39 available
Sub-Total: $0.00
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