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Electrical & Electronic Components > Potting & Encapsulating Compounds

Potting & Encapsulating Compounds

Potting and encapsulating products protect electronic components from moisture, dirt, thermal shock, and vibration. Potting is a process where electronic components are immersed in resin, which is then cured. Encapsulating products are used to create a mold or frame around electronic components to fill gaps between the component and frame. Epoxies, silicone rubber, and polyurethane adhesives are commonly used in these processes.

$2,779.12 / KT
Volume price $2,493.03
$26,283.15 / DR
Volume price $23,577.53
$3,053.35 / PA
Volume price $2,739.03
$347.97 / PA
Volume price $312.15
$11,445.78 / DR
Volume price $10,267.54
$1,252.72 / PA
Volume price $1,123.76
$100.62 / P1
Volume price $66.59
$1,006.13 / KT
Volume price $902.56
$3,268.80 / DR
Volume price $2,932.31
$367.73 / PA
Volume price $329.88
$3,081.53 / DR
Volume price $2,764.31
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