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Electrical & Electronic Components > Potting & Encapsulating Compounds

Potting & Encapsulating Compounds

Potting and encapsulating products protect electronic components from moisture, dirt, thermal shock, and vibration. Potting is a process where electronic components are immersed in resin, which is then cured. Encapsulating products are used to create a mold or frame around electronic components to fill gaps between the component and frame. Epoxies, silicone rubber, and polyurethane adhesives are commonly used in these processes.

$2,284.20 / KT
Volume price of $2,049.06 available
$1,071.30 / PA
Volume price of $961.02 available
$58.09 / CQ
Volume price of $38.44 available
$193.13 / P1
Volume price of $127.80 available
$4,301.62 / PA
Volume price of $3,858.81 available
$981.10 / PA
Volume price of $880.10 available
$530.00 / PA
Volume price of $475.44 available
$140.20 / QT
Volume price of $125.77 available
$1,757.50 / PA
Volume price of $1,576.58 available
$78.05 / CQ
Volume price of $51.65 available
$85.10 / PT
Volume price of $56.32 available
$1,139.60 / KT
Volume price of $1,022.29 available
$112.42 / CQ
Volume price of $74.39 available
$8,735.65 / PA
Volume price of $5,780.94 available
$10,494.00 / KT
Volume price of $9,413.74 available
$6,232.80 / DR
Volume price of $5,591.19 available
$1,630.60 / KT
Volume price of $1,462.74 available
$1,216.23 / PA
Volume price of $1,091.03 available
$1,710.13 / PA
Volume price of $1,534.09 available
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