Momentive TSE392 One-Part Potting & Encapsulating Compound Clear Paste 333 ml - TSE392-C 333M
TSE392-C 333M
Momentive clear one-part TSE392 potting & encapsulating compound is compatible with ceramic, copper, glass and plastic materials with a 7 day cure time. Each package contains 333 ml. This potting & encapsulating compound is packaged 333 ml per inner. This potting & encapsulating compound meets the following standards: UL94 HB.
Product Specifications
- Brand:Momentive
- Series:TSE392
- Chemical Base:Silicone
- Multi-Part Adhesive:One-Part
- Material Compatibility:Ceramic; Copper; Glass; Plastic
- Thermal Conductivity:0.18 W/m·K
- Dielectric Strength:22 kV/mm
- Cure Time:7 days
- Color:Clear
- Product Form:Paste
- Package Size:333 ml
- Package Quantity:333 ml per inner
- Standards Met:UL94 HB
