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Adhesives, Sealants, and Coatings::Devcon Epoxies, Urethanes, etc::Two Part Epoxy

HP250 (2:1 ratio) (50ml DevPak™)

HP250 (2:1 ratio) (50ml DevPak™)

A high-performance, room-temperature-curing epoxy adhesive with superior toughness, impact and chemical resistance for structural bonding applications. 2:1 ratio allows you to use Mark V gun with 2:1 plunger (DA091) for easy use!

Specifications: 

  • Gap-filling thixotropic paste
  • Heat resistant to 250°F
  • Long working time [50 minutes]
  • Must use [#14410] manual gun for 400ml size (#14415)
  • Must use DA 091 plunger for the 50 ml size (#14278)
  • Bonds to plastics

  1. Review
    UPC:078143143151
    Manufacturer:DEVCON
    Manufacturer ID: 14315
    RSHughes ID:078143-14315
    Safety Data: Material Safety Data Sheet
    Details: Product Datasheet
    Volume Discount Prices:
    Quantity, BOTTLE (BO) Price
    1 - 11 $22.07
    12 - 59 $13.25
    60 - $12.19
    Shipping not included

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R.S.Hughes Description

DEVCON HP250 (2:1 RATIO)
50ML
   

Keywords

DEVCON HP250 (2:1 ratio) (50ml DevPak™) DEVCON HP250 (2:1 RATIO) 50ML 078143-14315 14315 078143143151

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