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Adhesives, Sealants, and Coatings:: Devcon Epoxies, Urethanes, etc:: Two Part Epoxy
HP250 (2:1 ratio) (50ml DevPak™)
A high-performance, room-temperature-curing epoxy adhesive with superior toughness, impact and chemical resistance for structural bonding applications. 2:1 ratio allows you to use Mark V gun with 2:1 plunger (DA091) for easy use!
Specifications:
- Gap-filling thixotropic paste
- Heat resistant to 250°F
- Long working time [50 minutes]
- Must use [#14410] manual gun for 400ml size (#14415)
- Must use DA 091 plunger for the 50 ml size (#14278)
- Bonds to plastics
- Review
Volume Discount Prices:
| 1 - 11 |
$22.07 |
| 12 - 59 |
$13.25 |
| 60 - |
$12.19 |
Shipping not included
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R.S.Hughes Description
DEVCON HP250 (2:1 RATIO)
50ML
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Keywords
DEVCON HP250 (2:1 ratio) (50ml DevPak™) DEVCON HP250 (2:1 RATIO) 50ML 078143-14315 14315 078143143151
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