Devcon Potting & Encapsulating Compound Liquid 1 lb - 5:1 Mix Ratio - 10710
078143-10710
Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 75 min working time. Works in a mix ratio of 5:1. Delivers great performance with a shear strength of 2700 psi. Each package contains 1 lb. This potting & encapsulating compound is packaged 1 lb per inner. This potting & encapsulating compound meets the following standards: MMM-A-1754.
Product Specifications
- Brand:Devcon
- Chemical Base:Epoxy
- Material Compatibility:Metal
- Dielectric Strength:100 V/mil
- Cure Time:16 hr
- Working Life:75 min
- Product Form:Liquid
- Package Size:1 lb
- Mix Ratio:5:1
- Shear Strength:2700 psi
- Storage Condition:Store at Room Temperature
- Package Quantity:1 lb per inner
- Standards Met:MMM-A-1754
