Kester 331 Lead-Free Solder Wire - Sn/Ag/Cu - 0.031 in - 6402
92-7068-6402
The Kester 331 lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of 423 F. It's manufactured as a water soluble flux core. Total composition for this lead-free solder wire is sn96.5/ag3/cu0.5.
Product Specifications
- Brand:Kester
- Series:331
- Core Type:Water Soluble Flux Core
- Wire Diameter:0.031 in
- Elemental Composition:Sn/Ag/Cu
- Total Composition:Sn96.5/Ag3/Cu0.5
- Solder Weight:500 g
- Flux Percent:2.2%
- Melting Point:423 °F
