Kester 331 Water Soluble Flux Core Lead-Free Solder Wire - Sn/Ag/Cu - 0.01 in - 6442
24-7068-6442
The Kester 331 water soluble flux core lead-free solder wire is another quality product from Kester. Melting point is reached at a temperature of 423 F. It's manufactured as a water soluble flux core. Total composition for this water soluble flux core lead-free solder wire is sn96.5/ag03/cu0.5. This water soluble flux core lead-free solder wire meets the following standards: ORH1 (IPC/J STD 004), RoHS 2002/95/EC.
Product Specifications
- Brand:Kester
- Series:331
- Core Type:Water Soluble Flux Core
- Wire Diameter:0.01 in
- Elemental Composition:Sn/Ag/Cu
- Total Composition:Sn96.5/Ag03/Cu0.5
- Solder Weight:1 lb
- Flux Percent:3.3%
- Melting Point:423 °F
- Standards Met:ORH1 (IPC/J STD 004); RoHS 2002/95/EC
