Devcon Potting & Encapsulating Compound Paste 1 lb - 3:1 Mix Ratio - 10260
078143-10260
Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 35 min working time. Works in a mix ratio of 3:1. Delivers great performance with a shear strength of 2680 psi. Each package contains 1 lb. This potting & encapsulating compound is packaged 1 lb per inner.
Product Specifications
- Brand:Devcon
- Chemical Base:Epoxy
- Material Compatibility:Metal
- Dielectric Strength:25 V/mil
- Cure Time:16 hr
- Working Life:35 min
- Product Form:Paste
- Package Size:1 lb
- Mix Ratio:3:1
- Shear Strength:2680 psi
- Storage Condition:Store at Room Temperature
- Package Quantity:1 lb per inner
