Devcon Base & Accelerator (B/A) Potting & Encapsulating Compound Paste 1 lb - 4:1 Mix Ratio - 10610
078143-10610
Devcon potting & encapsulating compound is compatible with metal materials with a 16 hr cure time. Provides a 60 min working time. Works in a mix ratio of 4:1. Delivers great performance with a shear strength of 2600 psi. Each package contains 1 lb. This potting & encapsulating compound is packaged 3 lb per inner. This potting & encapsulating compound meets the following standards: DOD-C-24176B, Type II.
Product Specifications
- Brand:Devcon
- Chemical Base:Epoxy
- Base or Accelerator:Base & Accelerator (B/A)
- Material Compatibility:Metal
- Dielectric Strength:100 V/mil
- Cure Time:16 hr
- Working Life:60 min
- Product Form:Paste
- Package Size:1 lb
- Mix Ratio:4:1
- Shear Strength:2600 psi
- Storage Condition:Store at Room Temperature
- Package Quantity:3 lb per inner
- Standards Met:DOD-C-24176B, Type II
