Kester NXG1 Lead-Free Solder Paste - Jar - 1810
70-3205-1810
The Kester NXG1 no clean lead-free solder paste is another quality product from Kester. Total composition for this lead-free solder paste is sn99/ag0.3/cu0.7. Additional, and potentially important, information was collected about this product: T4 88.5%
Product Specifications
- Brand:Kester
- Series:NXG1
- Removal Type:No Clean
- Total Composition:Sn99/Ag0.3/Cu0.7
- Solder Weight:500 g
- Package Type:Jar
- Additional Information:T4 88.5%
