Kester NXG1 Lead-Free Solder Paste - Jar - 0810
70-3213-0810
The Kester NXG1 no clean lead-free solder paste is another quality product from Kester. Total composition for this lead-free solder paste is sn96.5/ag03/cu0.5. This lead-free solder paste meets the following standards: Bellcore GR 78, RoHS 2002/95/EC, ROL1 (IPC/J STD 004).
Product Specifications
- Brand:Kester
- Series:NXG1
- Removal Type:No Clean
- Total Composition:Sn96.5/Ag03/Cu0.5
- Solder Weight:500 g
- Package Type:Jar
- Standards Met:Bellcore GR 78; RoHS 2002/95/EC; ROL1 (IPC/J STD 004)
