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Potting & Encapsulating Compounds

Potting and encapsulating products protect electronic components from moisture, dirt, thermal shock, and vibration. Potting is a process where electronic components are immersed in resin, which is then cured. Encapsulating products are used to create a mold or frame around electronic components to fill gaps between the component and frame. Epoxies, silicone rubber, and polyurethane adhesives are commonly used in these processes.

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